Products from 3D Micromac related to Laser Structuring​.

microSTRUCT™ Product Family

Highly Versatile Laser Micromachining Systems

3D-Micromac‘s microSTRUCT™ laser systems are highly flexible laser micromachining system predominantly used in product development and applied research. Superior flexibility makes the systems ideally suited for laser structuring, cutting, drilling and welding applications on a variety of substrates, e.g. metals, semiconductors, alloys, transparent and biological material, ceramics and thin film compound systems.

microSTRUCT C

microSTRUCT Vario

microSTRUCT™ C offers:

  • ‚Two independent and free configurable working areas
  • Integration of up to two different laser sources
  • Various optical setups
  • Quick changing of work piece clamping unit
  • User-friendly, flexible, upgradeable system control

Configuration packages:

Basic:

  • One working area
  • Prepared for one laser source with one wavelength
  • Upgrade ready

Advanced:

  • Two working areas
  • Prepared for one laser source with up to three wavelengths

Superior:

  • Two working areas
  • Prepared for two laser sources with up to three wavelengths
  • Incl. high accuracy vision system, scanner upgrade and preinstalled process gas package

Options:

  • Different option packages available on request, e.g. high accuracy package, cylindrical work piece package, etc.


microSTRUCT™ vario offers:

  • ‚Up to three independent and free configurable
  • working areas
  • One single work piece fixation for all working areas
  • Integration of up to three different laser sources
  • User-friendly, flexible, upgradeable system control

Configuration packages:

Basic:

  • Two working areas
  • Prepared for one laser source with three wavelengths

Advanced:

  • Two working areas
  • Prepared for two laser sources with up to three wavelengths

Superior:

  • Three working areas
  • Prepared for two laser sources with up to three wavelengths and one additional laser source with one wavelength

Options:

  • Different option packages available:
    • Excimer laser package
    • High accuracy package
    • Multi-axis positioning package
    • Other options on request



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microFLEX™
Roll-to-Roll System for Processing of Flexible Electronic Devices

The modular microFLEX™ manufacturing system combines high-precision laser processes with coating and printing technologies for production of flexible electronic devices. In addition, different drying, annealing and pre-treatment steps as well as the encapsulation of the finished products can be done with the system.
Machining in a continuous roll-to-roll process and laser processing on-the-fly enables highest throughput and cost efficiency for the complete production process.

microFLEX™ TLS

microFLEX™ TLS offers:

  • ‚On-the-fly laser processing
  • Cleaning and preparation
  • Coating and printing
  • Drying and annealing
  • Packaging
  • Manufacturing Execution System microMES

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microCELL™ Product Family

Laser Systems for Processing Silicon Solar Cells

The microCELL™ production solutions, such as  high performance laser processing for Laser Contact Opening (LCO) of high efficient PERC solar cells as well as laser dicing of full cells into half cells with Thermal Laser Separation (TLS-Dicing™), are designed to meet cell manufacturers‘ demands for achieving maximum throughput rates and yield while diminishing cell manufacturing costs.

microCELL™ TLS

microCELL™ OTF

3D-Micromac‘s microCELL™ TLS is a highly productive laser system for separation of standard silicon solar cells into half cells. The microCELL™ TLS meets cell manufacturers‘ demands by retaining the mechanical strength of the cut cells.
The ablation free process guarantees an outstanding edge quality. Laser processing on-the-fly and an innovative handling concept enable maximum throughput and yield in the full-scale manufacturing of crystalline half cells.

microCELL™ TLS offers:

  • ‚ On-the-fly laser processing with unbeatable
  • cost-benefit ratio
  • One-pass contactless dicing process
  • High throughput > 3,800 wph on single lane
  • Dicing speed up to 300 mm/sec
  • Low cost of ownership and CAPEX
  • Inline integration into existing production lines

Configuration packages:

Stand-alone:

  • Two working areas on single lane for initial scribing and TLS cleaving
  • Handler-tool-in for full cells and handler-tool-out for half cells

Inline:

  • Two working areas on single lane for initial scribing and TLS cleaving
  • Inline system for complete integration into existing production lines

Options:

  • Breakage control / NIO discharge
  • RFID reader
  • Data matrix reader (DMC)
  • Wafer buffer system
  • MES system
  • Loading- and unloading handling as on customer specification



3D-Micromac‘s microCELL™ OTF is a highly productive laser system for processing of mono- and polycrystalline silicon solar cells. The microCELL™ OTF meets cell manufacturers‘ demands for increasing the e ciency, e.g. of PERC solar cells, by precise surface structuring, low operating costs, and highest availability.
Laser processing on-the-fly and an innovative handling concept enable maximum throughput and yield in the mass production of crystalline solar cells. The contactless cell handling enables processing without surface defects and microcracks.

microCELL™ OTF offers:

‚ On-the-fly laser processing with unbeatable
cost-benefit ratio
Contactless wafer handling
High throughput and efficiency (> 3,800 wph)
Low cost of ownership and CAPEX
Upgrade for existing production lines or expansion

Configuration packages

Stand-alone

  • High on duty of the laser > 98%
  • Handler-tool-in and handler-tool-out for maximum throughput

Inline

  • High on duty time of the laser > 98 %
  • Inline system for complete integration into existing production lines, e.g. in front of printing machine

Options

  • Breakage control / NIO discharge
  • RFID reader
  • Data matrix reader (DMC)
  • Wafer buffer system
  • MES system
  • Loading- and unloading handling as on customer specification



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Customer-specific laser systems for micromachining

We focus on laser micromachining of virtually any material using short-pulse and ultra-short pulse lasers as well as short wave lasers (UV).
Because of our many years of experience in laser technology – with solutions for production as well as in industry-related research – our machines achieve the best processing results in the µm and sub-µm range. The line-up of laser machines produced until now ranges from drills for producing print nozzles, micro-welding systems for producing implants, machines for microstructuring different types of glass for displays, roll-to-roll systems for manufacturing flexible solar cells, right to complex DUV laser systems.
Our qualified experts will be glad to help you find the perfect solution for your special tasks, because, as developer and manufacturer all in one, we can tailor all applications and systems exactly to suit your needs.

We look forward to your inquiries!

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